"செக்ஸ்" நோய்கள் அதிகரிப்புக்கு ஃபேஸ்புக்கும் முக்கிய காரணம்!

இங்கிலாந்தில் செக்ஸ் தொடர்பான நோய்களின் அதிகரிப்புக்கு ஃபேஸ்புக் முக்கியக் காரணமாக திகழ்வதாக ஆய்வு ஒன்று தெரிவிக்கிறது.செக்ஸ் நோய்கள் அங்கு நான்கு மடங்கு அதிகரித்து விட்டதாம். இதற்கு ஃபேஸ்புக்தான் காரணமாக இருப்பதாக அந்த ஆய்வுத் தகவல் தெரிவிக்கிறது.
இங்கிலாந்தில் சிபிலிஸ் நோயின் தாக்குதல் கடந்த காலங்களை விட தற்போது நான்கு மடங்கு அதிகரித்து விட்டதாம். இதற்கு முன்பின் அறியாதவர்களுடன் ஃபேஸ்புக் மூலம் தொடர்பை ஏற்படுத்திக் கொண்டு செக்ஸ் உறவு கொள்வதுதான் காரணம் என்கிறது அந்த ஆய்வு.
இதுகுறித்து ஆய்வை நடத்திய பொது சுகாதார நிறுவனத்தின் இயக்குநர் பீட்டர் கெல்லி கூறுகையில், சிபிலிஸ் நோயின் தாக்குதல் நான்கு மடங்கு அதிகரித்துள்ளது. ஏராளமான இளம் பெண்கள் இந்த நோயால் பாதிக்கப்பட்டு வருகின்றனர்.
இவர்களில் பெரும்பாலானவர்கள், இணையதளங்கள் மூலம் குறிப்பாக ஃபேஸ்புக் மூலம் அறிமுகம் இல்லாதவர்களுடன் தொடர்பை ஏற்படுத்திக் கொண்டு செக்ஸ் உறவு வைத்திருப்பதாக கூறியுள்ளனர்.
சோஷியல் நெட்வொர்க்கிங் இணையதளங்கள், சம்பந்தமே இல்லாதவர்களைக் கூட எளிதில் தொடர்பு கொள்ள வைக்க உதவுகிறது. இது செக்ஸ் நோய்களின் அதிகரிப்புக்குக் காரணமாக விடுகிறது.
20 ஆண்டுகளுக்கு முன்புதான் சிபிலிஸ் நோய் மிகப் பெரிய வியாதியாக இருந்தது. அப்போது ஆணுறையை அதிகம் பேர் பயன்படுத்தியதில்லை. ஆனால் இப்போது ஆணுறை குறித்த விழிப்புணர்வு அதிகம் உள்ள இந்தக் காலகட்டத்திலும் சிபிலிஸ் வேகமாகப் பரவுவது வியப்பாக உள்ளது.
பெண்களில் 20 முதல் 24 வயதுக்குட்பட்டோருக்குத்தான் சிபிலிஸ் அதிகம் தாக்கியுள்ளது. ஆண்களைப் பொறுத்தவரை 25 முதல் 34 வயது வரையிலானோரே பாதிக்கப்பட்டுள்ளனர்.
இன்டர்நெட் மூலம் அறிமுகமாகும் பெண்களுடன் செக்ஸ் உறவு வைத்து விட வேண்டும் என்று பெரும்பாலான ஆண்கள் நினைக்கிறார்கள். இவர்களைப் போன்றோருக்கு ஃபேஸ்புக் மிகப் பெரிய வடிகாலாக உள்ளது என்றார் கெல்லி.
இந்த பரபரப்பு ஆய்வு குறித்து ஃபேஸ்புக் நிறுவனம் இதுவரை விளக்கம் தரவில்லை.
Thanks To.....www.z9world.com

4 வயது குழந்தையின் 1.06 மீற்றர் வயிறு.

கிழக்கு சீனாவின் Shanxi மாகாணத்தின் Yuncheng நகரத்தில் Xue Caijuan என்ற தாய்க்குப் பிறந்த Hu Yunxing என்ற நான்கு வயதுக்குழந்தையின் அடி வயிறு சுமார் 1.06 மீற்றர் சுற்றளவு வரை வளர்ந்துள்ளது.

Intel Shows How A CPU Is Made - Amazing process

Sand. Made up of 25 percent silicon, is, after oxygen, the second most abundant chemical element that's in the earth's crust. Sand, especially quartz, has high percentages of silicon in the form of silicon dioxide (SiO2) and is the base ingredient for semiconductor manufacturing.

After procuring raw sand and separating the silicon, the excess material is disposed of and the silicon is purified in multiple steps to finally reach semiconductor manufacturing quality which is called electronic grade silicon. The resulting purity is so great that electronic grade silicon may only have one alien atom for every one billion silicon atoms. After the purification process, the silicon enters the melting phase. In this picture you can see how one big crystal is grown from the purified silicon melt. The resulting mono-crystal is called an ingot.

A mono-crystal ingot is produced from electronic grade silicon. One ingot weighs approximately 100 kilograms (or 220 pounds) and has a silicon purity of 99.9999 percent.

The ingot is then moved onto the slicing phase where individual silicon discs, called wafers, are sliced thin. Some ingots can stand higher than five feet. Several different diameters of ingots exist depending on the required wafer size. Today, CPUs are commonly made on 300 mm wafers.

Once cut, the wafers are polished until they have flawless, mirror-smooth surfaces. Intel doesn't produce its own ingots and wafers, and instead purchases manufacturing-ready wafers from third-party companies. Intel’s advanced 45 nm High-K/Metal Gate process uses wafers with a diameter of 300 mm (or 12-inches). When Intel first began making chips, it printed circuits on 50 mm (2-inches) wafers. These days, Intel uses 300 mm wafers, resulting in decreased costs per chip.

The blue liquid, depicted above, is a photo resist finish similar to those used in film for photography. The wafer spins during this step to allow an evenly-distributed coating that's smooth and also very thin.

At this stage, the photo-resistant finish is exposed to ultra violet (UV) light. The chemical reaction triggered by the UV light is similar to what happens to film material in a camera the moment you press the shutter button.
Areas of the resist on the wafer that have been exposed to UV light will become soluble. The exposure is done using masks that act like stencils. When used with UV light, masks create the various circuit patterns. The building of a CPU essentially repeats this process over and over until multiple layers are stacked on top of each other.
A lens (middle) reduces the mask's image to a small focal point. The resulting "print" on the wafer is typically four times smaller, linearly, than the mask's pattern.

In the picture we have a representation of what a single transistor would appear like if we could see it with the naked eye. A transistor acts as a switch, controlling the flow of electrical current in a computer chip. Intel researchers have developed transistors so small that they claim roughly 30 million of them could fit on the head of a pin.

After being exposed to UV light, the exposed blue photo resist areas are completely dissolved by a solvent. This reveals a pattern of photo resist made by the mask. The beginnings of transistors, interconnects, and other electrical contacts begin to grow from this point.

The photo resist layer protects wafer material that should not be etched away. Areas that were exposed will be etched away with chemicals.

After the etching, the photo resist is removed and the desired shape becomes visible.

More photo resist (blue) is applied and then re-exposed to UV light. Exposed photo resist is then washed off again before the next step, which is called ion doping. This is the step where ion particles are exposed to the wafer, allowing the silicon to change its chemical properties in a way that allows the CPU to control the flow of electricity.

Through a process called ion implantation (one form of a process called doping) the exposed areas of the silicon wafer are bombarded with ions. Ions are implanted in the silicon wafer to alter the way silicon?i these areas conduct electricity. Ions are propelled onto the surface of the wafer at very high velocities. An electrical field accelerates the ions to a speed of over 300,000 km/hour (roughly 185,000 mph)

After the ion implantation, the photo resist will be removed and the material that should have been doped (green) now has alien atoms implanted.

This transistor is close to being finished. Three holes have been etched into the insulation layer (magenta color) above the transistor. These three holes will be filled with copper, which will make up the connections to other transistors.

The wafers are put into a copper sulphate solution at this stage. Copper ions are deposited onto the transistor through a process called electroplating. The copper ions travel from the positive terminal (anode) to the negative terminal (cathode) which is represented by the wafer.

The copper ions settle as a thin layer on the wafer surface.

The excess material is polished off leaving a very thin layer of copper.

Multiple metal layers are created to interconnects (think wires) in between the various transistors. How these connections have to be “wired” is determined by the architecture and design teams that develop the functionality of the respective processor (for example, Intel’s Core i7 processor). While computer chips look extremely flat, they may actually have over 20 layers to form complex circuitry. If you look at a magnified view of a chip, you will see an intricate network of circuit lines and transistors that look like a futuristic, multi-layered highway system.

This fraction of a ready wafer is being put through a first functionality test. In this stage test patterns are fed into every single chip and the response from the chip monitored and compared to "the right answer."

After tests determine that the wafer has a good yield of functioning processor units, the wafer is cut into pieces (called dies).

The dies that responded with the right answer to the test pattern will be put forward for the next step (packaging). Bad dies are discarded. Several years ago, Intel made key chains out of bad CPU dies.

This is an individual die, which has been cut out in the previous step (slicing). The die shown here is a die of an Intel Core i7 processor.

The substrate, the die, and the heatspreader are put together to form a completed processor. The green substrate builds the electrical and mechanical interface for the processor to interact with the rest of the PC system. The silver heatspreader is a thermal interface where a cooling solution will be applied. This will keep the processor cool during operation.

A microprocessor is the most complex manufactured product on earth. In fact, it takes hundreds of steps and only the most important ones have been visualized in this picture story.

During this final test the processors will be tested for their key characteristics (among the tested characteristics are power dissipation and maximum frequency).

Based on the test result of class testing processors with the same capabilities are put into the same transporting trays. This process is called "binning". Binning determines the maximum operating frequency of a processor, and batches are divided and sold according to stable specifications.

The manufactured and tested processors (again Intel Core i7 processor is shown here) either go to system manufacturers in trays or into retail stores in a box. Many thanks to Intel for supplying the text and photos in this picture story. Check out Intel's site for full size images of this entire process.